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Development Engineer Waferbond and Laser Lift Off Processes (d/m/w)
Aktualität: 21.10.2021


21.10.2021, OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung
Development Engineer Waferbond and Laser Lift Off Processes (d/m/w)
Autonomous planning, execution and evaluation of experiments covering wafer-to-wafer bonding and/or laser lift off processes within the frame of running product projects Development of novel frontend processes from scratch to production readiness in the area of adhesive and/or metallic waferbonding and/or laser lift off,including tool concepts,tool specification & procurement,tool & process setup and process stabilization & transfer to production Exchange with others within the project and process network,especially project leader(s),key experts and counterparts in production
Successfully accomplished studies of mechanical or electrical engineering, physics or similar classes, OR technical apprenticeship and professional experience with semiconductor tools Experience in the area of wafer-to-wafer bonding and in the area of laser lift off Joy with planning, performing and evaluation of experiments Autonomous and thorough work skills Good team and communication skills German and English language skills paired with willingness to travel globally